Энергосайт

DEPARTMENT OF DEFENSE

WASHINGTON DC 20301

MIL-HDBK-419A

GROUNDING, BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES

1. This standardization handbook was developed by the Department of Defense in accordance with

established procedure.

2. This publication was approved on 29 December 1987 for printing and inclusion in the military

standardization handbook series. Vertical lines and asterisks are not used in this revision to identify changes

with respect to the previous issue due to the extensiveness of the changes.

3. This document provides basic and application information on grounding, bonding, and shielding

practices recoin mended for electronic equipment. It will provide valuable information and guidance to

personnel concerned with the preparation of specifications and the procurement of electrical and electronic

equipment for the Defense Communications System. The handbook is not intended to be referenced in purchase

specifications except for informational purposes, nor shall it supersede any specification requirements.

4. Every effort has been made to reflect the latest information on the interrelation of considerations

of electrochemistry , metallurgy, electromagnetic, and atmospheric physics. It is the intent to review this

handbook periodically to insure its completeness and currency. Users of this document are encouraged to report

any errors discovered and any recommendations for changes or inclusions to: Commander, 1842 EEG/EEITE,

Scott AFB IL 62225-6348.

5. Copies of Federal and Military Standards, Specifications and associated documents (including this

handbook) listed in the Department of Defense Index of Specifications and Standards (DODISS) should be

obtained from the DOD Single Stock Point: Commanding Officer, Naval Publications and Forms Center, 5801

Tabor Avenue, Philadelphia PA 19120. Single copies may be obtained on an emergency basis by calling

(AUTOVON) 442-3321 or Area Code (215)-697-3321. Copies of industry association documents should be

obtained from the sponsor. Copies of all other listed documents should be obtained from the contracting

activity or as directed by the contracting officer.